Heterogeneous Integrations 1st Edition by John H Lau ISBN 9811372233 978-9811372230

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Product details:

ISBN 10: 9811372233 

ISBN 13: 978-9811372230

Author: John H. Lau

 Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

Table of contents: 

1. Overview of Heterogeneous Integrations

2. Heterogeneous Integrations on Organic Substrates

3. Heterogeneous Integrations on Silicon Substrates (TSV-Interposers)

4. Heterogeneous Integrations on Silicon Substrates (Bridges)

5. Fan-Out Wafer/Panel-Level Packaging for Heterogeneous Integrations

6. Heterogeneous Integrations on Fan-Out RDL Substrates

7. Heterogeneous Integration of PoP

8. Heterogeneous Integration of Memory Stacks

9. Heterogeneous Integration of Chip-to-Chip Stacks

10. Heterogeneous Integration of CIS, LED, MEMS, and VCSEL

11. Trends in Heterogeneous Integrations

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