3D Microelectronic Packaging From Architectures to Applications 2nd edition by Yan Li, Deepak Goyal 9811570902 9789811570902

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Product details:

ISBN 10: 9811570902 

ISBN 13: 9789811570902

Author: Yan Li, Deepak Goyal 

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.

3D Microelectronic Packaging: From Architectures to Applications 2nd table of contents: 

1. Introduction to 3D Microelectronic Packaging
2. 3D Packaging Architectures and Assembly Process Design
3. Materials and Processing of TSV
4. Microstructure and Mechanical Reliability Issues of TSV
5. Phase-Field-Crystal Model: A Tool for Probing Atoms in TSV
6. Atomic Scale Kinetics of TSV Protrusion
7. Fundamentals and Failures in Die Preparation for 3D Packaging
8. Direct Cu to Cu Bonding and Alternative Bonding Techniques in 3D Packaging
9. Copper Micro and Nano Particles Mixture for 3D Interconnection Application
10. Fundamentals of Bonding Technology and Process Materials for 2.5/3D Packages
11. Fundamentals of Solder Alloys in 3D Packaging
12. Fundamentals of Electromigration in Interconnects of 3D Packaging
13. Fundamentals of Heat Dissipation in 3D IC Packaging and Thermal-Aware Design
14. Fundamentals of Advanced Materials and Processes in Organic Substrate Technology
15. Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization
16. Processing and Reliability of Solder Interconnections in Stacked Packaging
17. Interconnect Quality and Reliability of 3D Packaging
18. Fault Isolation and Failure Analysis of 3D Packaging

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Tags: 3D Microelectronic, Packaging, Architectures, Applications, Yan Li, Deepak Goyal