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3D Microelectronic Packaging From Fundamentals to Applications 1st Edition Yan Li

Name: 3D Microelectronic Packaging From Fundamentals to Applications 1st Edition Yan Li
SKU: EB-5838670
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3D Microelectronic Packaging From Fundamentals to Applications 1st Edition Yan Li Digital Instant Download

Author(s): Yan Li, Deepak Goyal (eds.)

ISBN(s): 9783319445847, 9783319445861, 3319445847, 3319445863

Edition: 1

File Details: PDF, 20.87 MB

Year: 2017

Language: English

SKU: EB-5838670 Category: Engineering Tags: Deepak Goyal (eds.), Yan Li

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ISBN-10 ‏ : ‎ 3319830864
ISBN-13 ‏ : ‎ 978-3319830865
Author: Yan Li

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.

Table of contents:

Chapter 1: Introduction to 3D Microelectronic Packaging

Chapter 2: 3D Packaging Architectures and Assembly Process Design

Chapter 3: Materials and Processing of TSV

Chapter 4: Microstructural and Reliability Issues of TSV

Chapter 5: Fundamentals and Failures in Die Preparation for 3D Packaging

Chapter 6: Direct Cu to Cu Bonding and Other Alternative Bonding Techniques in 3D Packaging

Chapter 7: Fundamentals of Thermal Compression Bonding Technology and Process Materials for 2.5/3D P

Chapter 8: Fundamentals of Solder Alloys in 3D Packaging

Chapter 9: Fundamentals of Electromigration in Interconnects of 3D Packaging

Chapter 10: Fundamentals of Heat Dissipation in 3D IC Packaging

Chapter 11: Fundamentals of Advanced Materials and Processes in Organic Substrate Technology